Zvinogoneka zvinokonzeresa uye zvinoenderana mhinduro dzedambudziko rekudhirowa sealant

A. Low humidity kwezvakatipoteredza

Kuderera kwezvakatipoteredza humidity kunokonzera kunonoka kurapwa kwechisimbiso.Semuenzaniso, muchirimo uye matsutso kuchamhembe kwenyika yangu, hunyoro hwemhepo hwakaderera, dzimwe nguva hunotomira kutenderera 30% RH kwenguva yakareba.

Solution: Edza kusarudza mwaka kuvakwa kwe tembiricha uye humidity nyaya.

B. Musiyano mukuru wetembiricha yezvakatipoteredza (tembiricha yakawandisa musiyano pazuva rimwe chete kana mazuva maviri akatarisana)

Munguva yekuvaka, chikwata chekuvaka chinotarisira kuti kukurumidza kuporesa kwechisimbiso kunofanira kunge kwakakurumidza sezvinobvira, kuitira kuti kuderedza mukana wekukanganiswa nekunze kwezvinhu.Nekudaro, kune maitiro ekurapa sealant, izvo zvinowanzotora mazuva akati wandei.Nokudaro, kuitira kuti ikurumidze kukurumidza kuporesa kweglue, vashandi vekuvaka vanowanzoita chivakwa pasi pemamiriro ekuvaka akakodzera.Kazhinji, mamiriro ekunze (kunyanya tembiricha uye humidity) inosarudzwa pakuvaka pane tembiricha yakagadzikana uye yakakodzera kuvakwa (inochengetwa pane imwe tembiricha uye mwando kwenguva yakareba).

Solution: Edza kusarudza mwaka uye nguva ine diki tembiricha musiyano wekuvaka, senge makore ekuvaka.Mukuwedzera, nguva yekuporesa yesilicone weather-resistant sealant inoda kuva pfupi, iyo inogonawo kuvimbisa kuti chisimbiso hachizobviswa nemamwe masimba ekunze panguva yekurapa kuti iite glue.

C. Panel zvinhu, saizi uye chimiro

Iwo ma substrates akasungwa nema sealants anowanzo girazi uye aluminium.Aya ma substrates anozowedzera uye anobvumirana nekushisa sezvo tembiricha inochinja, izvo zvinozoita kuti glue rive pasi pekutonhora kutambanudza uye kupisa kupisa.

Iyo coefficient yekuwedzera kwemutsara inonziwo coefficient yekuwedzera kwemutsara.Kana tembiricha yechinhu chakasimba ichichinja ne1 degree Celsius, chiyero chekuchinja kwehurefu hwayo kusvika pakureba kwayo patembiricha yekutanga (kwete hazvo 0 ° C) inonzi "coefficient of linear expansion".Iyo unit ndeye 1/℃, uye chiratidzo chiri αt.Tsanangudzo yayo ndeye αt = (Lt-L0)/L0∆t, kureva, Lt=L0 (1+αt∆t), apo L0 ndiyo saizi yekutanga yezvinhu, Lt ukuru hwechinyorwa pa t ℃, uye ∆t ndiyo tembiricha Musiyano.Sezvinoratidzwa mutafura iri pamusoro, iyo yakakura saizi yearuminiyamu ndiro, zvinonyanya kuoneka chiitiko chinoputika cheglue mumubatanidzwa weglue.Iyo yakabatana deformation yeyakasarudzika-yakaumbwa aluminium ndiro yakakura kupfuura iyo yeflat aluminium plate.

Solution: Sarudza aluminium ndiro uye girazi ine diki mutsara wekuwedzera coefficient, uye teerera zvakanyanya kune iyo yakareba nzira (ipfupi divi) yearuminiyamu sheet.Kubudirira kupisa kuitisa kana kudzivirira kwealuminium ndiro, sekuvhara ndiro yealuminium nefirimu rezuva.Iyo "yechipiri saizi" chirongwa chinogona zvakare kushandiswa pakuvaka.

D. Kufurira kwemasimba ekunze

Zvivako zvepamusoro-soro zvinotapukira kune simba re monsoon.Kana mhepo yakasimba, ichaita kuti glue yemamiriro ekunze iwedzere.Mazhinji maguta munyika yedu ari munzvimbo yemonsoon, uye zvivakwa zvechidzitiro zvemadziro zvichazununguka zvishoma nekuda kwekumanikidzwa kwemhepo yekunze, zvichikonzera shanduko muhupamhi hwemajoini.Kana glue ikashandiswa kana mhepo yakasimba, iyo sealant ichaputika nekuda kwekutama kweplate isati yanyatsopora.

Mhinduro: Usati washandisa glue, nzvimbo yealuminium sheet inofanira kugadziriswa zvakanyanya sezvinobvira.Panguva imwecheteyo, dzimwe nzira dzinogona kushandiswawo kuderedza kushanda kwesimba rekunze pane pepa realuminium.Zvinorambidzwa kushandisa glue pasi pemamiriro emhepo yakanyanyisa.

E. kuvakwa kusina kunaka

1. Gungano reglue uye chigadziko chine hunyoro hwepamusoro uye mvura;

2. Tsvimbo yefuro inokwenywa netsaona panguva yekuvaka/ kudzika kwepamusoro kwetsvimbo yefuro kwakasiyana;

3. The foam strip/double-sided tepi yakanga isina kutsetseka isati yaiswa saizi, uye yakaputika zvishoma mushure mekuyera.Yakaratidza kubhuroka chiitiko mushure mekuita saizi.

4. Tsvimbo yehuputi inosarudzwa zvisina kururama, uye furo haigoni kuva pasi-density foam sticks, iyo inofanira kuenderana nezvinodiwa;

5. Kukora kwesaizi hakuna kukwana, kutetepa zvakanyanya, kana ukobvu hwesaizi haina kuenzana;

6. Mushure mokunge splicing substrate yashandiswa, glue haina kusimbiswa uye inofambisa zvachose, zvichiita kuti pave nekutama pakati pe substrates uye kugadzira blisters.

7. Doro-based glue ichaputika kana ikashandiswa pasi pezuva (apo substrate surface tembiricha yakakwirira).

Solution: Pamberi pekuvaka, ita shuwa kuti marudzi ese e substrates ari mumamiriro ekuvaka emamiriro ekunze-resistant sealant nyaya, uye tembiricha uye hunyoro munharaunda zviri zvakare mune yakakodzera renji (inokurudzirwa mamiriro ekuvaka).