SV Thermal Conductive Two Component 1:1 electronic potting compound Sealant for Junction Box
Product Description
FEATURES
1. Low viscosity, yakanaka fluidity, kukurumidza bubble dissipation.
2. Yakanakisa magetsi ekudzivirira uye kupisa conduction.
3. Inogona kunge yakadzika potting pasina chizvarwa cheyakaderera molecular zvinhu panguva yekurapa, ine yakanyanya kuderera shrinkage uye yakanakisa kunamatira kune zvikamu.
PACKAGING
A:B =1:1
Chikamu: 25KG
B chikamu: 25 KG
MASHANDISO AVASEKO
1. Potting uye kusapinda mvura yemutyairi weLED, maballasts, uye reverse parking sensors.
2. Insulation, thermal conduction, hunyoro-proofing, uye kugadzirisa mabasa kune zvimwe zvikamu zvemagetsi
TYPICAL PROPERTIES
Aya makoshero haana kuitirwa kushandiswa mukugadzirira zvakatemwa
| PROPERTY | A | B | |
| Pamberi Musanganiswa | Chitarisiko | Chena | Nhema |
| (25℃,65%RH) | Viscosity | 2500±500 | 2500±500 |
| Density (25℃, g/cm³) | 1.6±0.05 | 1.6±0.05 | |
| After Mixtured | Proportion Ratio (Nehuremu) | 1 | 1 |
| (25℃,65%RH) | Color | Gireyi | |
| Viscosity | 2500~3500 | ||
| Nguva Yekushanda (min) | 40~60 | ||
| Nguva yekurapa (H, 25 ℃) | 3~4 | ||
| Nguva yekurapa (H, 80 ℃) | 10~15 | ||
| Mushure mekuvhiyiwa | Kuoma (Shore A) | 55±5 | |
| (25℃,65%RH) | Tensile Strength (Mpa) | ≥1.0 | |
| Thermal Conductivity (W/m·k) | ≥0.6~0.8 | ||
| Dielectric Simba (KV/mm) | ≥14 | ||
| Dielectric Constant (1.2MHz) | 2.8~3.3 | ||
| Kuramba Kwevhoriyamu (Ω·cm) | ≥1.0×1015 | ||
| Coefficient Yekuwedzera Linear (m/m·k) | ≤2.2×10-4 | ||
| Kushanda Tembiricha (℃) | -40~100 | ||
Nyora meseji yako pano uye titumire kwatiri
