SV Thermal Conductive Two Component 1:1 electronic potting compound Sealant yeJunction Box

Tsananguro pfupi:

SV electronic potting compound Sealant yakagadzirirwa kuputira uye kusapinda mvura ye LED driver, ballasts, uye reverse parking sensors.

Tumira email kwatiri

Ruzivo rweChigadzirwa

Matagi eChigadzirwa

Tsananguro yeChigadzirwa

ZVINHU ZVINHU

1. Kusviba kwakaderera, kuyerera kwakanaka, kupararira kwemabubble nekukurumidza.

2. Kudzivirira kwemagetsi kwakanaka uye kufambisa kupisa.

3. Inogona kubikwa muhari yakadzika pasina kugadzirwa kwezvinhu zvishoma panguva yekugayiwa, ine shrinkage shoma uye inonamatira zvakanaka kuzvikamu zvayo.

KUPAKISHA
A:B =1:1

Chikamu: 25 KG

Chikamu B: 25 KG

ZVINHU ZVAKASHANDISWA

1. Kuisa muhari uye kusapinda mvura kwe LED driver, ballasts, uye reverse parking sensors.

2. Kudzivirira kupisa, kufambisa kupisa, kudzivirira hunyoro, uye kugadzirisa zvimwe zvikamu zvemagetsi

ZVINHU ZVAKAJAIRWA

Aya mapoinzi haana kuitirwa kushandiswa pakugadzira zvinodiwa

ZVINHU	A	B
Pamberi peMusanganiswa	Chitarisiko	Chena	Nhema
(25℃,65%RH)	Kusviba	2500±500	2500±500
	Kuwanda (25℃, g/cm³)	1.6±0.05	1.6±0.05
Mushure mekusanganiswa	Chiyero cheKuenzana (Nehuremu)	1	1
(25℃,65%RH)	Ruvara	Gireyi
	Kusviba	2500~3500
	Nguva Yekushanda (min)	40~60
	Nguva Yokupora (H, 25℃)	3~4
	Nguva Yokupora (H, 80℃)	10~15
Mushure meKurapa	Kuoma (Shongwe A)	55±5
(25℃,65%RH)	Simba reKusimba (Mpa)	≥1.0
	Kufambisa kwekupisa (W/m·k)	≥0.6~0.8
	Simba reDielectric (KV/mm)	≥14
	Dielectric Constant (1.2MHz)	2.8~3.3
	Kudzivirira Vhoriyamu (Ω·cm)	≥1.0×1015
	Kuwedzerwa kwemutsetse kweCoefficient (m/m·k)	≤2.2×10-4
	Kushanda Tembiricha (℃)	-40~100